Method of making interconnecting multilayer circuits

Claim 1

THE METHOD OF MAKING A PLURALITY OF CIRCUITS INTERCONNECTED AT A PLURALITY OF DISCRETE POINTS, SAID METHOD COMPRISING THE STEPS OF PLACING ON A BASE PLATE A FIRST LAYER OF THERMOPLASTIC MATERIAL HAVING A COPPER FOIL BONDED THERETO, ETCHING AN INSULATING PATH AROUND A DESIRED CIRCUIT CONFIGURATION TO PROVIDE AN INSUATED SPACE BETWEEN THE DESIRED CIRCUIT CONFIGURATION AND THE REMAINING COPPER FOIL, FORMING DIMPLED PORTIONS IN SAID CIRCUIT CONFIGURATION AT SAID DISCRETE POINTS, AND LAMINATING SUCCEEDING LAYERS OF THERMOPLASTIC MATERIAL AND COPPER FOIL THEREON, ETCHING THE FOIL AND FORMING DIMPLED PORTIONS IN A SIMILAR MANNER, SIMULTANEOUSLY APPLYING HEAT AND A CUTTING FORCE THROUGH SAID ALIGNED DIMPLED PORTIONS TO PROVIDE A HOLE THERETHROUGH AND TO MELT OUT THERMOPLASTIC MATERIAL IN THE IMMEDIATE VICINITY OF THE HOLE TO EXPOSE FOR A CONNECTION THESE DIMPLED PORTIONS HAVING HOLES THERETHROUGH, ELECTROCONDUCTIVELY SENSITIZING THE WALLS OF SAID HOLE AND EXPOSE DIMPLED CONDUCTIVE PORTIONS AND THEREAFTER ELECTROPLATING SAID WALL AND CONDUCTIVE PORTIONS WITH A CONDUCTIVE MATERIAL TO PROVIDE A MECHANICAL AND ELECTRICAL INTERCONNECTION BETWEEN SAID CIRCUITS AT SAID DISCRETE POINTS.

Claim 2

THE METHOD OF MAKING A PLURALITY OF CIRCUITS INTERCONNECTED AT A PLURALITY OF DISCRETE POINTS, SAID METHOD COMPRISING THE STEPS OF PLACING ON A BASE PLATE A FIRST LAYER OF THERMOPLASTIC MATERIAL HAVING A COPPER FOIL BONDED THERETO, ETCHING AN INSULATING PATH AROUND A DESIRED CIRCUIT CONFIGURATION TO PROVIDE AN INSUATED SPACE BETWEEN THE DESIRED CIRCUIT CONFIGURATION AND THE REMAINING COPPER FOIL, FORMING DIMPLED PORTIONS IN SAID CIRCUIT CONFIGURATION AT SAID DISCRETE POINTS, AND LAMINATING SUCCEEDING LAYERS OF THERMOPLASTIC MATERIAL AND COPPER FOIL THEREON, ETCHING THE FOIL AND FORMING DIMPLED PORTIONS IN A SIMILAR MANNER, SIMULTANEOUSLY APPLYING HEAT AND A CUTTING FORCE THROUGH SAID ALIGNED DIMPLED PORTIONS TO PROVIDE A HOLE THERETHROUGH AND TO MELT OUT THERMOPLASTIC MATERIAL IN THE IMMEDIATE VICINITY OF THE HOLE TO EXPOSE FOR A CONNECTION THESE DIMPLED PORTIONS HAVING HOLES THERETHROUGH, ELECTROCONDUCTIVELY SENSITIZING THE WALLS OF SAID HOLE AND EXPOSE DIMPLED CONDUCTIVE PORTIONS AND THEREAFTER ELECTROPLATING SAID WALL AND CONDUCTIVE PORTIONS WITH A CONDUCTIVE MATERIAL TO PROVIDE A MECHANICAL AND ELECTRICAL INTERCONNECTION BETWEEN SAID CIRCUITS AT SAID DISCRETE POINTS.