US3184830A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer printed circuit board fabrication technique
Assignee: Individual
•
Filing: 1961-08-01
•
Granted: 1965-05-25
•
Expires: 1981-08-01
Abstract
No abstract record available.
Inventors
- 👤 Weldon V Lane
- 👤 Edmund E Malecki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-22 22:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; H01; H01R; H01R12/00; H01R12/70; H01R12/71; H01R12/712; H01R12/716; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2201/09818; H05K2201/09845; H05K2201/10; H05K2201/10007; H05K2201/10189; H05K2201/10227; H05K2201/10295; H05K2201/10303; H05K2201/10613; H05K2201/10742; H05K2201/10886; H05K2201/10939; H05K2203/00; H05K2203/04; H05K2203/044; H05K2203/045; H05K3/3465; H05K3/3468; H05K3/40; H05K3/4038; H05K3/4046; H05K3/46; H05K3/4611; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
135 words
A METHOD OF MAKING COMPOSITE LAMINATED CIRCUIT UNITS COMPRISING PREPARING A PLURALITY OF INDIVIDUAL PRINTED CIRCUIT BOARDS HAVING METALLIC CIRCUITS THEREON DESIGNED TO MAKE FUNCTIONAL CONNECTION WITH AT LEAST A PORTION OF AN ELECTRONIC SYSTEM, THE SYSTEM INCLUDING PORJECTING AND INTERCONNECTING CONDUCTORS, SAID CIRCUITS HAVING TERMINAL AREAS FOR CONNECTION WITH THE INTERCONNECTING CONDUCTORS OF THE SYSTEM, APPLYING SOLDER TO SAID TERMINAL AREAS, FORMING CLEARANCE CHAMBERS IN SAID BOARDS AT SAID TERMINAL AREAS TO RECEIVE SAID SOLDER THAN APPLYING DIELECTRIC CEMENT TO AT LEAST ONE INTERENGAGING FACE OF SAID CIRCUITS BOARDS, SUPERPOSING SAID BOARDS AND APPLYING PRESSURE THERETO UNTIL SAID CEMENT HARDENS, THEN FORMING INTERCONNECTING CONDUCTOR RECEIVING HOLES AT SAID TERMINAL AREAS EXTENDING THROUGH THE BOARDS, THE TERMINAL AREAS AND THE SOLDER, INSERTING SAID CONDUCTORS IN THE HOLES, AND THEN HEATING THE SOLDER TO SOLDERING TEMPERATURE.
Claim 2
Independent Claim
135 words
A METHOD OF MAKING COMPOSITE LAMINATED CIRCUIT UNITS COMPRISING PREPARING A PLURALITY OF INDIVIDUAL PRINTED CIRCUIT BOARDS HAVING METALLIC CIRCUITS THEREON DESIGNED TO MAKE FUNCTIONAL CONNECTION WITH AT LEAST A PORTION OF AN ELECTRONIC SYSTEM, THE SYSTEM INCLUDING PORJECTING AND INTERCONNECTING CONDUCTORS, SAID CIRCUITS HAVING TERMINAL AREAS FOR CONNECTION WITH THE INTERCONNECTING CONDUCTORS OF THE SYSTEM, APPLYING SOLDER TO SAID TERMINAL AREAS, FORMING CLEARANCE CHAMBERS IN SAID BOARDS AT SAID TERMINAL AREAS TO RECEIVE SAID SOLDER THAN APPLYING DIELECTRIC CEMENT TO AT LEAST ONE INTERENGAGING FACE OF SAID CIRCUITS BOARDS, SUPERPOSING SAID BOARDS AND APPLYING PRESSURE THERETO UNTIL SAID CEMENT HARDENS, THEN FORMING INTERCONNECTING CONDUCTOR RECEIVING HOLES AT SAID TERMINAL AREAS EXTENDING THROUGH THE BOARDS, THE TERMINAL AREAS AND THE SOLDER, INSERTING SAID CONDUCTORS IN THE HOLES, AND THEN HEATING THE SOLDER TO SOLDERING TEMPERATURE.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1968-05-24 | 1968-11-23 | 1969-05-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1972-05-24 | 1972-11-23 | 1973-05-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1976-05-24 | 1976-11-23 | 1977-05-25 | $7700.00 | Window Closed / Lapsed |