US3075282A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device contact
Assignee: AT&T Inc
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Filing: 1959-07-24
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Granted: 1963-01-29
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Expires: 1979-07-24
Abstract
No abstract record available.
Inventors
- 👤 Joseph H Mcconville
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 13:31
CPC Classifications
H; H10; H10P; H10P95/00; H10D; H10D62/00; H10D62/10; Y; Y10; Y10S; Y10S228/00; Y10S228/903; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
74 words
A METHOD FOR CONNECTING A LEAD WIRE TO AN EXPOSED SURFACE OF A SEMICONDUCTOR WAFER IN THE ABSENCE OF AN INTERMEDIATE ELECTRODE COMPRISING, FORMING ON THE FRONT END OF SAID LEAD WIRE AN UNCOATED MOLTEN BALL OF SAID LEAD WIRE MATERIAL, AND PROPELLING SAID LEAD WIRE, MOLTEN BALL FIRST, INTO CONTACT WITH SAID EXPOSED SURFACE, THE TEMPERATURE OF SAID MOLTEN BALL BEING SUFFICIENT AT THE MOMENT OF IMPACT TO MELT THE IMPACTED SURFACE PORTION.
Claim 2
Independent Claim
74 words
A METHOD FOR CONNECTING A LEAD WIRE TO AN EXPOSED SURFACE OF A SEMICONDUCTOR WAFER IN THE ABSENCE OF AN INTERMEDIATE ELECTRODE COMPRISING, FORMING ON THE FRONT END OF SAID LEAD WIRE AN UNCOATED MOLTEN BALL OF SAID LEAD WIRE MATERIAL, AND PROPELLING SAID LEAD WIRE, MOLTEN BALL FIRST, INTO CONTACT WITH SAID EXPOSED SURFACE, THE TEMPERATURE OF SAID MOLTEN BALL BEING SUFFICIENT AT THE MOMENT OF IMPACT TO MELT THE IMPACTED SURFACE PORTION.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1966-01-28 | 1966-07-30 | 1967-01-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1970-01-28 | 1970-07-30 | 1971-01-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1974-01-28 | 1974-07-30 | 1975-01-29 | $7700.00 | Window Closed / Lapsed |