Electeodepositiqn of metaiis

Claim 1

ELECTROLYTIC METHOD OF CLOSING OPENINGS IN METALLIC SURFACES, WHICH COMPRISES: MECHANICALLY IMPARTING TO AN OPENING THE FORM OF A DEPRESSION WHOSE DEPTH IS SLIGHT RELATIVE TO ITS LEAST WIDTH; FILLING ANY PART OF THE OPENING WHICH IS DEEPER THAN SAID DEPRESSION, WITH ELECTRICALLY CONDUCTING MATERIAL; PROVIDING SAID DEPRESSION WITH A CONTINUOUS UNINTERRUPTED ELECTRICALLY CONDUCTING SURFACE THROUGHOUT ITS ENTIRE AREA; ENCLOSING THE ELECTRICALLY CONDUCTING SURFACE OF SAID DEPRESSION IN AN ELECTROLYTIC CELL; ELECTROPYTICALLY PREPARING THE SURFACE OF SAID DEPRESSION FOR RECEIVING AN ADHERENT ELECTROPLATE; THEREAFER ELECTROLYTICALLY DEPOSITING METAL IN SAID DEPRESSION, AND MAINTAINING DURING SAID ELECTRODEPOSITION A SUBSTANTIALLY CONTINUOUS FLOW OF THE ELECTROPLATING SOLUTION THROUGH SAID CELL, SUBMERGING AND WASHING OVER THE SURFACE OF SAID DEPRESSION.