Method of coating with organopolysiloxanes

Claim 1

THE METHOD WHICH COMPRISES APPLYING A MIXTURE OF A TOLUENE SOLUBLE ORGANIOPOLYSILOXANE IN LIQUID STATE, AN INORGANIC FILLER MELTING ABOVE 350*C. AND A DIACYL PEROXIDE IN AMOUNT LESS THAN 8 PER CENT BY WEIGHT BASED UPON THE WEIGHT OF THE POLYSILOXANE BUT IN AMOUNT SUFFICIENT TO PROMOTE CURING OF THE SILOXANE TO A TACK-FREE STATE, THE FILLER BEING PRESENT IN SUCH PROPORTION AS TO FORM A PASTE, TO A BASE MEMBER TO FORM A COATING THEREON OF BETWEEN 0.1 AND 7 MILS THICKNESS, RAISING THE TEMPERATURE OF SAID COATING TO AT LEAST 180*C. BUT NOT ABOVE 400*C. WITHIN 2 MINUTES AND MAINTAINING THE TEMPERATURE WITHIN THE RANGE OF 180*C. TO 400*C. UNTIL THE COATING IS CURED, THE ORGANIC SUBSTITUENTS OF SAID ORGANOPOLYSILOXANE BEING MONOVALENT HYDROCARBON RADICALS ATTACHED TO THE SILICON THROUGH CARBON TO SILICON LINKAGES, THERE BEING ON THE AVERAGE BETWEEN 1.75 AND 2.25 OF SAID RADICALS PER SILICON ATOM AND THERE BEING PRESENT IN THE SILOXANE AT LEAST 60 MOL PER CENT OF THE STRUCTURAL UNIT CORRESPONDING TO THE FORMULA R2S.0 WHERE R IS AN ALKYL RADICAL, AND SAID DIACYL PEROXIDE CONTAINING AT LEAST ONE AROMATIC ACYL RADICAL.

Claim 2

THE METHOD WHICH COMPRISES APPLYING A MIXTURE OF A TOLUENE SOLUBLE ORGANIOPOLYSILOXANE IN LIQUID STATE, AN INORGANIC FILLER MELTING ABOVE 350*C. AND A DIACYL PEROXIDE IN AMOUNT LESS THAN 8 PER CENT BY WEIGHT BASED UPON THE WEIGHT OF THE POLYSILOXANE BUT IN AMOUNT SUFFICIENT TO PROMOTE CURING OF THE SILOXANE TO A TACK-FREE STATE, THE FILLER BEING PRESENT IN SUCH PROPORTION AS TO FORM A PASTE, TO A BASE MEMBER TO FORM A COATING THEREON OF BETWEEN 0.1 AND 7 MILS THICKNESS, RAISING THE TEMPERATURE OF SAID COATING TO AT LEAST 180*C. BUT NOT ABOVE 400*C. WITHIN 2 MINUTES AND MAINTAINING THE TEMPERATURE WITHIN THE RANGE OF 180*C. TO 400*C. UNTIL THE COATING IS CURED, THE ORGANIC SUBSTITUENTS OF SAID ORGANOPOLYSILOXANE BEING MONOVALENT HYDROCARBON RADICALS ATTACHED TO THE SILICON THROUGH CARBON TO SILICON LINKAGES, THERE BEING ON THE AVERAGE BETWEEN 1.75 AND 2.25 OF SAID RADICALS PER SILICON ATOM AND THERE BEING PRESENT IN THE SILOXANE AT LEAST 60 MOL PER CENT OF THE STRUCTURAL UNIT CORRESPONDING TO THE FORMULA R2S.0 WHERE R IS AN ALKYL RADICAL, AND SAID DIACYL PEROXIDE CONTAINING AT LEAST ONE AROMATIC ACYL RADICAL.