US20030099444A1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Submount for opto-electronic module and packaging method using the same
Assignee: Electronics and Telecommunications Research Institute
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Filing: 2002-02-08
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Granted: —
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Expires: 2022-02-08
Abstract
Abstract A submount for an opto-electronic module for outputting light incident from an opto-electronic device as an electrical signal is provided. The submount includes a dielectric material and an interconnection line. The dielectric material has a polygonal shape including a front face and a bottom face. The interconnection line is attached to the front face and the bottom face of the dielectric material. The interconnection line has a coplanar waveguide structure and is electrically to the opto-electronic device to output signals from the opto-electronic device.
Inventors
- 👤 Sung-il Kim
- 👤 Jong-won Lim
- 👤 Hae-Cheon Kim
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 00:59
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4274; G02B6/4279
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
74 words
1 . A submount for an opto-electronic module for outputting light incident from an opto-electronic device as an electrical signal, the submount comprising: a dielectric material having a polygonal shape with a front face and a bottom face; and an interconnection line having a coplanar waveguide structure, attached to the front face and the bottom face of the dielectric material, and electrically connected to the opto-electronic device to output signals from the opto-electronic device.
Claim 2
Dependent Claim
74 words
1 . A submount for an opto-electronic module for outputting light incident from an opto-electronic device as an electrical signal, the submount comprising: a dielectric material having a polygonal shape with a front face and a bottom face; and an interconnection line having a coplanar waveguide structure, attached to the front face and the bottom face of the dielectric material, and electrically connected to the opto-electronic device to output signals from the opto-electronic device.
Claim 3
Dependent Claim
34 words
2 . The submount for an opto-electronic module of claim 1 , wherein the interconnection line having a coplanar waveguide structure comprises a plurality of interconnection lines, which are spaced apart from each other.
Claim 4
Dependent Claim
39 words
3 . The submount for an opto-electronic module of claim 2 , wherein the interconnection lines are a first ground line, a signal transmission line, a second ground line, and a bias application line, respectively, which are sequentially disposed.
Claim 5
Dependent Claim
37 words
4 . The submount for an opto-electronic module of claim 3 , wherein the opto-electronic device is attached to a portion of the second ground line, which is attached to the front face of the dielectric material.
Claim 6
Dependent Claim
36 words
5 . The submount for an opto-electronic module of claim 4 , wherein the opto-electronic device attached to the second ground line is connected to the signal transmission line and the bias application line via wires.
Claim 7
Dependent Claim
68 words
6 . The submount for an opto-electronic module of claim 2 , wherein the distance between a portion of the signal transmission line and a portion of the second ground line on the bottom face of the dielectric material is greater than the distance between a portion of the signal transmission line and a portion of the second ground line on the front face of the dielectric material.
Claim 8
Dependent Claim
69 words
7 . A packaging method using a submount for an opto-electronic module including a dielectric material and an interconnection line having a coplanar waveguide structure, the packaging method comprising: (a) attaching an opto-electronic device to the interconnection line to electrically connect the opto-electronic device to the interconnection line; and (b) attaching the interconnection line, to which the opto-electronic device is attached, to a conductive interconnection line of a substrate.
Claim 9
Dependent Claim
69 words
7 . A packaging method using a submount for an opto-electronic module including a dielectric material and an interconnection line having a coplanar waveguide structure, the packaging method comprising: (a) attaching an opto-electronic device to the interconnection line to electrically connect the opto-electronic device to the interconnection line; and (b) attaching the interconnection line, to which the opto-electronic device is attached, to a conductive interconnection line of a substrate.
Claim 10
Dependent Claim
17 words
8 . The packaging method of claim 7 , wherein step (b) is performed using conductive epoxy.
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