Package for integrated circuit

Abstract

Abstract PURPOSE:To shield alpha rays generated from the inner wall of a package by filling a hollow generated therein with a resin such as plastics when an IC chip is housed in the package made of a ceramic. CONSTITUTION:The IC chip 5 is housed in a recess of the ceramic package 1 which is provided with a plurality of external connection lead wires 3 facing downward. A specified connection is made with a bonding wire 4 and the open end of the top thereof is covered with a metal cap 2. Thus, the IC package is constructed. The hollow herein produced in the package 1 is filled with a resin 6 such as plastics. This enables complete shieling of alpha rays as emitted from the ceramic inner wall thereby improving the heat dissipating effect with a less heat resistance.

Inventors

• 👤 Takeo Uchiyama

Bibliographic Details