Vapor deposition method of aluminum on both surfaces of band-shaped substrate

Abstract

Abstract PURPOSE:To efficiently execute vapor deposition on both surfaces by drastically shortening the time for vapor deposition operation. CONSTITUTION:After the band-shaped substrate 12 is delivered from a feed tapered roller 18 in the state of inclining the band-shaped substrate at 45 deg. to a vapor deposition route above a target 6 to be evaporated by heating, the surface of the band-shaped substrate 12 is subjected to the vapor deposition, the band-shaped substrate 12 is twisted 90 deg. enroute in such a manner that the center of the twisted part is perpendicular. The rear surface 12b of the band- shaped substrate 12 is subjected to the vapor deposition in the state of inclining the band-shaped substrate 12 at 45 deg. opposite and the band-shaped substrate is received on a receiving tapered roller 19, by which both surfaces of the band- shaped substrate 12 are subjected to the vapor deposition at one time.

Inventors

• 👤 Hidehiko Maehata
• 👤 英彦 前畑
• 👤 Masanori Tsukahara
• 👤 正徳 塚原
• 👤 Hiroshige Arai
• 👤 浩成 荒井

Bibliographic Details