Multilayer circuit forming body and manufacture of the same

Abstract

Abstract PURPOSE:To realize a small size forming body which does require troublesome procedures for assembling and connection by forming an internal circuit forming body consisting of a conductive part of the predetermined shape, an insulating body formed outside thereof by an injection molding and a conductive layer in the predetermined region on the surface of such insulating body. CONSTITUTION:A copper plate is punched into a predetermined shape to obtain an internal layer circuit 1. It is then put into a metal die and polyester sulfone is ejected for molding to form a molded body 5. Since a projection extended up to the internal layer circuit 1 is provided at the internal surface of metal die in such a position as corresponding to a through hole 3, after necessary preprocessing is conducted to the surface of the molded body 5, a plating catalyst is adhered to the necessary part of the surface and the internal surface of a through hole 3, electroless copper plating is conducted to this portions to form a metal layer 4 operating as an external layer circuit, thereby completing a double-layer circuit forming body 6. Accordingly, troublesome procedures are not required for assembling and connection, realizing reduction in size.

Inventors

• 👤 Toshiyuki Oaku
• 👤 大阿久　俊幸

Bibliographic Details