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JPH0336003A Expired / Lapsed JP ⏱️ 0.0 years remaining

Dicing device

Assignee: Seiko Epson Corp
•
Filing: 1989-07-04
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Granted: —
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Expires: 2009-07-04
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Abstract

Abstract PURPOSE:To improve the treatment capacity of a device, while the loss of working time is shortened by a method in which in the dicing for the assembly of LSI and IC, two spindles are provided, and one spindle thereof is reversely rotated to the rotation of the other spindle. CONSTITUTION:A dicing device has two spindles 1, 2 and then the spindle 1 is rotated in clock-wise and the spindle 2 is rotated in counter-clock-wise. Working is carried out when the spindles are lowered in the direction Z and are moved in the direction X. When the spindle 1 achieves working (b), the spindle 2 is moved with the spindle 1(a) in the state of being raised. When the spindle 2 is lowered in the direction Z(b), and achieves working (c), the spindle 1 is moved (d) with the spindle 2 in the state of being raised. Thus, since the operation moving in the direction X without the achieving of working by blades, is omitted, the treatment capacity is improved more than that of a conventional device by about 30%.

Inventors

  • 👤 Toyokazu Kato
  • 👤 豊和 加藤

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-10-23 18:57
CPC Classifications
B; B28; B28D; B28D5/00; B28D5/02; B28D5/022; B28D5/029

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