JPH01259541A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Manufacture of compound bonding wire
Assignee: Kobe Steel Ltd
•
Filing: 1988-04-11
•
Granted: —
•
Expires: 2008-04-11
Abstract
Abstract Translated from Japanese (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Inventors
- 👤 Akiyasu Morita
- 👤 森田 章靖
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-10-23 04:06
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/01551; H10W72/50; H10W72/521; H10W72/522; H10W72/523; H10W72/551; H10W72/552; H10W72/5522; H10W72/555
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.