GB985671A - - Google Patents

Abstract

Abstract 985,671. Semi-conductor devices. TELEFUNKEN PATENTVERWERTUNGS G.m.b.H. Sept. 29, 1961 [Oct. 1, 1960; Oct. 14, 1960], No. 35187/61. Heading H1K. A semi-conductor device mounted on a header is disposed in a blind hole in a metal block of parallelipiped form with the header sealing off the hole, for example as illustrated in Fig. 8. In this case dissipation of heat from the transistor is facilitated by soldering the collector 6 (as shown) and/or the emitter to a massive cooling plate 17 and filling the remainder of the bore with a heat-conducting mixture of zinc oxide and silicon oil. The block is massive enough to resist distortion by pressures used in assembling the header therein. A threaded hole (as shown) or a slot is provided in the end of the block to allow it to be bolted to a chassis. In alternative devices using similar blocks, which may be of aluminium or tinned copper a metal cylinder or helix is provided surrounding the base plate to facilitate cooling. Another possibility is to make the base plate a tight fit in the bore, the edges of the plates being provided with a strip of ductile metal, e.g. indium to provide a better overall thermal contact with the bore walls. Several devices may be bolted side by side in tiers to form a block through which the temperature is sensibly constant.

Inventors

No inventors recorded.

Bibliographic Details