EP0846741A1
Expired / Lapsed
EP
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Polishing composition
Assignee: Fujimi Inc
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Filing: 1997-12-03
•
Granted: —
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Expires: 2017-12-03
Abstract
Abstract A polishing composition comprising fumed silica, a basic potassium compound and water, of which the specific electric conductivity is from 100 to 5,500 µS/cm.
Inventors
- 👤 Shirou c/o Fujimi Incorporated Miura
- 👤 Atsunori c/o Fujimi Incorporated Kawamura
- 👤 Kazusei c/o Fujimi Incorporated Tamai
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 15:34
CPC Classifications
B; B24; B24B; B24B37/00; H; H10; H10P; H10P90/00; H10P90/12; H10P90/129; C; C01; C01B; C01B33/00; C01B33/113; C01B33/12; C01B33/18; C09; C09G; C09G1/00; C09G1/02; C09K; C09K3/00; C09K3/14; H10P52/00
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
24 words
A polishing composition comprising fumed silica, a
basic potassium compound and water, of which the specific
electric conductivity is from 100 to 5,500 µS/cm.
Claim 2
Dependent Claim
40 words
The polishing composition according to Claim 1,
wherein the basic potassium compound is selected from the
group consisting of a hydroxide, a phosphate, a
pyrophosphate, a phosphite, a carbonate, a silicate, a
borate, a hypochlorite, a hypobromite and a carboxylate.
Claim 3
Dependent Claim
33 words
The polishing composition according to Claim 1 or 2,
wherein, based on the total amount of the polishing
composition, the basic potassium compound is in an amount
of from 0.01 to 0.5 wt%.
Claim 4
Dependent Claim
24 words
A polishing composition comprising fumed silica, a
nitrogen-containing basic compound and water, of which
the specific electric conductivity is from 100 to 1,500
µS/cm.
Claim 5
Dependent Claim
44 words
The polishing composition according to Claim 4,
wherein the nitrogen-containing basic compound is
selected from the group consisting of an ammonium
hydroxide, an ammonium phosphate, an ammonium carbonate,
an ammonium silicate, an ammonium borate, an ammonium
hypochlorite, an ammonium hypobromite and an amine
compound.
Claim 6
Dependent Claim
33 words
The polishing composition according to Claim 4 or 5,
wherein, based on the total amount of the polishing
composition, the nitrogen-containing basic compound is in
an amount of from 0.01 to 1 wt%.
Claim 7
Dependent Claim
28 words
The polishing composition according to any one of
Claims 1 to 6, wherein the fumed silica has a mean
primary particle size of from 5 to 80 nm.
Claim 8
Dependent Claim
20 words
A polishing composition comprising colloidal silica
and water, of which the specific electric conductivity is
from 30 to 5,000 µS/cm.
Claim 9
Dependent Claim
14 words
The polishing composition according to Claim 8, which
also contains a basic potassium compound.
Claim 10
Dependent Claim
40 words
The polishing composition according to Claim 9,
wherein the basic potassium compound is selected from the
group consisting of a hydroxide, a phosphate, a
pyrophosphate, a phosphite, a carbonate, a silicate, a
borate, a hypochlorite, a hypobromite and a carboxylate.
Claim 11
Dependent Claim
32 words
The polishing composition according to Claim 9 or 10,
wherein, based on the total amount of the polishing
composition, the basic potassium compound is in an amount
of at most 1.5 wt%.
Claim 12
Dependent Claim
24 words
A polishing composition comprising colloidal silica,
a nitrogen-containing basic compound and water, of which
the specific electric conductivity is from 30 to 1,500
µS/cm.
Claim 13
Dependent Claim
47 words
The polishing composition according to Claim 12,
wherein the nitrogen-containing basic compound is
selected from the group consisting of an ammonium
hydroxide, an ammonium phosphate, an ammonium carbonate,
an ammonium silicate, an ammonium borate, an ammonium
hypochlorite, an ammonium hypobromite, an ammonium
carboxylate and an amine compound.
Claim 14
Dependent Claim
33 words
The polishing composition according to Claim 12 or
13, wherein, based on the total amount of the polishing
composition, the nitrogen-containing basic compound is in
an amount of from 0.01 to 0.5 wt%.
Claim 15
Dependent Claim
28 words
The polishing composition according to any one of
Claims 8 to 14, wherein the colloidal silica has a mean
primary particle size of from 5 to 200 nm.
Claim 16
Dependent Claim
23 words
Use of the polishing composition as defined in claim
1, 4, 8 or 12 as a composition for polishing a silicon
dioxide film.
Claim 17
Dependent Claim
32 words
A method for polishing a silicon dioxide film,
wherein the polishing composition as defined in Claim 1,
4, 8 or 12 is used as a composition for polishing the
silicon dioxide film.
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