EP0447020A1
Expired / Lapsed
EP
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Integrated package having a thermoelectric cooler
Assignee: International Business Machines Corp
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Filing: 1991-01-18
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Granted: —
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Expires: 2011-01-18
Abstract
Abstract A thermoelectrically cooled integrated circuit package (10) including an insulative module (12) which defines a cavity (14), a thermoelectric cooler (20) within the cavity, and an integrated circuit chip (16) connected to the thermoelectric cooler, thus providing an integrated circuit package in which the integrated circuit package itself dissipates thermal energy generated by the integrated circuit chip.
Inventors
- 👤 Mohanlal S. Mansuria
- 👤 Joseph M. Mosley
- 👤 Richard D. Musa
- 👤 William F. Shutler
- 👤 Vito J. Tuozzolo
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-22 21:01
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/28; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10S; Y10S257/00; Y10S257/93
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
70 words
An integrated circuit package (10) comprising: an electrically insulative module (12) having a plurality of walls defining a cavity (14), and a plurality of input/output pins (22), an integrated circuit chip (16) positioned within the cavity (14), and electrically connected to the input/output pins (22), characterised in the package (10) further comprises: a thermoelectric cooler (20), thermally connected between the integrated circuit chip (16) and a wall of cavity (14).
Claim 2
Dependent Claim
43 words
An integrated circuit package (10) as claimed in claim 1 wherein the thermoelectric cooler (20) includes a plurality of thermoelectric cooler elements (40) each having a first end oriented towards the module and a second end oriented towards the integrated circuit chip (16).
Claim 3
Dependent Claim
41 words
An integrated circuit package (10) as claimed in claim 2 wherein the module (12) includes conductors (44), electrically connecting alternate first ends of the thermoelectric cooler elements (40) so as to provide a relatively hotter side of the thermoelectric cooler (20).
Claim 4
Dependent Claim
75 words
An integrated circuit package (10) as claimed in claim 2 further comprising a cold plate (38) positioned between the integrated circuit chip (16) and the thermoelectric cooler (20), conducting thermal energy from the integrated circuit chip (16) to the thermoelectric cooler (20), the cold plate (38) including conductors (42), the conductors electrically connecting alternate second ends of the thermoelectric cooler elements (40) so as to provide a relatively colder side of the thermoelectric cooler (20).
Claim 5
Dependent Claim
21 words
An integrated circuit package (10) as claimed in claim 2 wherein the thermoelectric cooler elements (40) are constructed of semiconductor materials.
Claim 6
Dependent Claim
25 words
An integrated circuit package (10) as claimed in claim 5 wherein the thermoelectric cooler elements (40) are constructed of different types of the semiconductor materials.
Claim 7
Dependent Claim
23 words
An integrated circuit package (10) as claimed in claim 6 wherein the different types of semiconductor materials include P-type material and N-type material.
Claim 8
Dependent Claim
27 words
An integrated circuit package (10) as claimed in claim 7 wherein the P-type material and N-type material are arranged alternately, electrically in series and thermally in parallel.
Claim 9
Dependent Claim
27 words
The integrated circuit package as claimed in any preceeding of claim 1 further comprising: a heat sink (28) attached to an exterior wall of the module (12).
Claim 10
Dependent Claim
29 words
An integrated circuit package (10) as claimed in any preceeding claim wherein the input/output pins (22) are electrically connected to the integrated circuit chip via (16) wire bond connections.
Claim 11
Dependent Claim
33 words
An integrated circuit package (10) as calimed in any claim any preceeding claim (10) wherein the input/output pins (22) are electrically connected to the integrated circuit chip (16) via controlled chip collapse connections.
Claim 12
Dependent Claim
22 words
An integrated circuit package (10) as claimed in any preceeding claim wherein the thermoelectric cooler (20) is hermetically sealed within the module.
Claim 13
Dependent Claim
34 words
An integrated circuit (10) as claimed in any preceeding claim wherein the module (12) defines thermoelectric cooler conductor channels, and thermoelectric cooler conductors (22, 34) electrically connect the thermoelectric cooler to the input/output pins.
Claim 14
Dependent Claim
25 words
An integrated circuit package (10) as claimed in claim 13 wherein portions of the thermoelectric cooler conductors are located along walls of the module cavity.
Claim 15
Dependent Claim
24 words
An integrated circuit package (10) as claimed in claim 1 further comprising a plurality of integrated circuit chips thermally connected to the thermoelectric cooler.
Claim 16
Dependent Claim
40 words
An integrated circuit package (10) as claimed in 1 further comprising a plurality of integrated circuit chips (16), and a plurality of thermoelectric coolers (20) thermally connected between the integrated circuit chips (16) and a wall of the cavity (14).
Claim 17
Dependent Claim
25 words
An integrated circuit package (10) as claimed in of claim 16 wherein the plurality of thermoelectric coolers (20) correspond to respective integrated circuit chips (16).
References Cited (Backward Citations)
WO1983002527A1
Cited
EP0314481A1
Cited
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