EP0407951A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method for applying a photoresist to a 3-D conductive substrate
Assignee: Shipley Co Inc
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Filing: 1990-07-10
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Granted: —
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Expires: 2010-07-10
Abstract
Abstract A process for manufacturing a 3-dimensional circuit board by electrophoretic deposition whereby a) providing the board with a conductive surface and b) applying a photoresist by electrophoretic deposition.
Inventors
- 👤 Eugene D. D'ottavio
- 👤 Robert E. Hawkins
- 👤 Stephen S. Rodriguez
- 👤 James Rychwalski
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 17:52
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/108; G; G03; G03F; G03F7/00; G03F7/16; G03F7/164; H05K3/02; H05K3/06; H05K3/061; H05K3/064; H05K1/00; H05K1/02; H05K1/0284; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K2203/00; H05K2203/13; H05K2203/1333; H05K2203/135; H05K3/062
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
35 words
A process for coating a three dimensional substrate with a photoresist comprising the steps of: a) providing a conductive surface on the substrate; and b) applying a photoresist composition to the surface by electrophoretic deposition.
Claim 2
Dependent Claim
35 words
A process for coating a three dimensional substrate with a photoresist comprising the steps of: a) providing a conductive surface on the substrate; and b) applying a photoresist composition to the surface by electrophoretic deposition.
Claim 3
Dependent Claim
25 words
The process of claim 1, wherein the surface of the substrate is contacted with an adhesion promotion agent prior to providing a conductive surface thereon.
Claim 4
Dependent Claim
16 words
The process of claim 1, wherein the surface of the substrate is rendered conductive by metallization.
Claim 5
Dependent Claim
25 words
The process of claim 3, wherein metallization of the surface is with a metal selected from the group of copper, nickel, tin, or mixtures thereof.
Claim 6
Dependent Claim
21 words
The process of claim 3 wherein the metallization comprises applying a layer of nickel over a layer of a different metal.
Claim 7
Dependent Claim
22 words
The process of claim 1, wherein the substrate is selected from the group of polyetherimide, polyethersulfone, epoxy, polyimide, tetrafluoroethylene, or mixtures thereof.
Claim 8
Dependent Claim
13 words
The process of claim 1, wherein the photoresist composition includes a coalescing agent.
Claim 9
Dependent Claim
33 words
the process of claim 7, wherein the coalescing agent is selected from the group of 1-nitropropane, 2-nitropropane, methyl pyrrolidone, ethylene glycol ethylhexylether, propylene glycol methylether, 2,2,4-trimethyl - 1,3 pentanediol monoisobutyrate, or mixtures thereof.
Claim 10
Dependent Claim
10 words
The process of claim 1, wherein the photoresist is anaphoretic.
Claim 11
Dependent Claim
10 words
The process of claim 1, wherein the photoresist is cataphoretic.
Claim 12
Dependent Claim
31 words
The process of claim 1, further comprising the addition of a stabilizing agent to the photoresist composition selected from the group of hydroquinone, phenothiazine, methoxy hydroquinine, tert-butyl catechol or mixtures thereof.
Claim 13
Dependent Claim
16 words
The process of claim 1, further comprising the addition of a dye to the photoresist composition.
Claim 14
Dependent Claim
77 words
A process for coating a three dimensional substrate with a photoresist comprising the steps of: a) metalizing the surface of the substrate; b) building up the metallized surface with a metal selected from the group of copper, nickel, tin or mixtures thereof; c) electrophoretically applying a photoresist composition to the built up surface; d) exposing and developing the photoresist; e) removing the metal exposed by step d) with an etchant; and f) removing the remaining undeveloped photoresist.
Claim 15
Dependent Claim
77 words
A process for coating a three dimensional substrate with a photoresist comprising the steps of: a) metalizing the surface of the substrate; b) building up the metallized surface with a metal selected from the group of copper, nickel, tin or mixtures thereof; c) electrophoretically applying a photoresist composition to the built up surface; d) exposing and developing the photoresist; e) removing the metal exposed by step d) with an etchant; and f) removing the remaining undeveloped photoresist.
Claim 16
Dependent Claim
15 words
The process of claim 13, wherein the metallized surface is built up by electroless deposition.
Claim 17
Dependent Claim
15 words
The process of claim 13, wherein the metallized surface is built up by electrolytic deposition.
Claim 18
Dependent Claim
74 words
A process for coating a three dimensional substrate with a photoresist comprising the steps of: a) metalizing the surface of the substrate; b) electrophoretically applying a photoresist composition to the built up surface; c) exposing and developing the photoresist; d) building up the exposed areas with a metal selected from the group of copper, nickel, tin or mixtures thereof; e) removing the remaining undeveloped photoresist and; f) removing the background metal with an etchant.
Claim 19
Dependent Claim
74 words
A process for coating a three dimensional substrate with a photoresist comprising the steps of: a) metalizing the surface of the substrate; b) electrophoretically applying a photoresist composition to the built up surface; c) exposing and developing the photoresist; d) building up the exposed areas with a metal selected from the group of copper, nickel, tin or mixtures thereof; e) removing the remaining undeveloped photoresist and; f) removing the background metal with an etchant.
Claim 20
Dependent Claim
15 words
The process of claim 16, wherein the metallized surface is built up by electroless deposition.
Claim 21
Dependent Claim
15 words
The process of claim 17, wherein the metallized surface is built up by electrolytic deposition.
References Cited (Backward Citations)
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