EP0361192B1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method of making circuit boards
Assignee: Siemens AG
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Filing: 1989-09-11
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Granted: 1994-02-23
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Expires: 2009-09-11
Abstract
No abstract record available.
Inventors
- 👤 Antoon Mattelin
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 04:57
CPC Classifications
C; C23; C23F; C23F1/00; C23F1/02; B; B44; B44C; B44C1/00; B44C1/22; H; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H05K3/07; B29; B29L; B29L2031/00; B29L2031/34; B29L2031/3493; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K2201/09209; H05K2201/0929; H05K2201/09363; H05K2203/00; H05K2203/03; H05K2203/0361; H05K2203/07; H05K2203/0703; H05K2203/072; H05K2203/13; H05K2203/1333; H05K2203/135; H05K2203/14; H05K2203/1476; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/027; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
147 words
Process for the production of printed-circuit boards, with the following process steps: a) a metal layer (4) and a first etch-resist layer (5) are applied successively onto an electrically insulating substrate (1); b) the first etch-resist layer (5) is removed again, by electromagnetic radiation, in the areas bordering immediately on the subsequent conductor track pattern; c) the areas of the metal layer (4) exposed in step b) are etched away as far as the surface of the substrate (1); d) a second metallic etch-resist layer (7) is applied on the remaining areas of the metal layer(4); e) the areas (8) not corresponding to the conductor track pattern are anodically contacted; f) in the anodically contacted areas (8) the whole etch-resist is electrolytically eroded; g) the areas of the metal layer (4) exposed in step e) are etched away as far as the surface of the substrate (1);
Claim 2
Dependent Claim
31 words
Process according to Claim 1, characterized in that, after the etching carried out in step c), the first etch-resist layer is completely removed before the second etch-resist layer (7) is applied.
Claim 3
Dependent Claim
27 words
Process according to Claim 1 or 2, characterized in that the metal layer (4) is applied by electroless and electrical deposition of copper on the substrate (1).
Claim 4
Dependent Claim
30 words
Process according to one of the preceding Claims, characterized in that tin or a tin-lead alloy is used for the first etch-resist layer (5) and the second etchresist layer (7).
Claim 5
Dependent Claim
28 words
Process according to one of the preceding Claims, characterized in that the first etch-resist layer (5) and the second etch-resist layer (7) are applied by electroless metal deposition.
Claim 6
Dependent Claim
20 words
Process according to one of the preceding Claims, characterized in that the electromagnetic radiation (S) is produced by a laser.
Claim 7
Dependent Claim
22 words
Process according to Claim 6, characterized in that the movement of the laser beam relative to the substrate (1) is freely programmable.
Claim 8
Dependent Claim
22 words
Process according to one of the preceding Claims, characterized in that a three-dimensional, injection-moulded substrate (1) with moulded-in through-plated holes is used.
References Cited (Backward Citations)
No citation records indexed.
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