A Method for the preparation of a diamond-clad machining tool
Abstract
Abstract The diamond-clad machining tool of the invention is prepared by the steps of (a) forming a film (2) of diamond of 10 to 1000 µm thickness by the method of vapor-phase deposition on the surface of a temporary substrate (1) of, e.g., silicon, (b) bonding the diamond film as borne by the temporary substrate to the surface of a base body of the tool (3) by brazing (4) and (c) removing the temporary substrate (1), e.g., by grinding to leave the diamond film (2) bonded to the base body of the tool by brazing. The method is advantageous in the versatility in respect of the material of substrate (1) on which a diamond film (2) is deposited from the vapor phase as well as in the firmness of bonding between the cladding layer (2) and the base body of the tool (3) in comparison with the conventional vapor-phase deposition method of diamond directly to the surface of the base body of a tool.
Inventors
- 👤 Fuminori Okuzumi
- 👤 Junichi Matsuda
Bibliographic Details
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