EP0231937A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
An arrangement of a semiconductor device for use in a card
Assignee: Maxell Ltd
•
Filing: 1987-02-04
•
Granted: —
•
Expires: 2007-02-04
Abstract
Abstract A card like semiconductor device comprising a circuit board made of plastic resin and a semiconductor pellet (1) mounted to the circuit board (2), wherein a metal layer (8) is formed on one surface of the semiconductor pellet on which semiconductor circuit is not formed. The semiconductor pellet is secured to the circuit board by bonding the metal layer to the circuit board and being sealed with high polymer material (5) on the circuit board.
Inventors
- 👤 Hiroshi Yamamoto
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 14:28
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/699; H10W72/00; H10W72/30; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/07337; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
73 words
A card like semiconductor device comprising a circuit board made of plastic resin and a semiconductor pellet mounted to the circuit board, wherein the improvement comprise a metal layer formed on one surface of the semiconductor pellet on which semiconductor circuit is not formed, the semiconductor pellet being secured to the circuit board by bonding the metal layer to the circuit board and being sealed with high polymer material on the circuit board.
Claim 2
Dependent Claim
73 words
A card like semiconductor device comprising a circuit board made of plastic resin and a semiconductor pellet mounted to the circuit board, wherein the improvement comprise a metal layer formed on one surface of the semiconductor pellet on which semiconductor circuit is not formed, the semiconductor pellet being secured to the circuit board by bonding the metal layer to the circuit board and being sealed with high polymer material on the circuit board.
Claim 3
Dependent Claim
50 words
The device according to claim 1, wherein an alloy layer is formed by at least one kind of metal element of the metal layer and at least one kind of metal element of the material constituting the semiconductor pellet in the interface of the metal layer and the semiconductor pellet.
Claim 4
Dependent Claim
32 words
The device according to claim 1, wherein said metal layer is formed by at least one kind of metal selected from a group consisting of gold, silver, nickel, aluminum, chromium and molybdenum.
Claim 5
Dependent Claim
18 words
The device according to claim 1, wherein the thickness of the metal layer is thinner than 20 µm.
Claim 6
Dependent Claim
26 words
The device according to claim 1, wherein said one face of the semiconductor pellet on which the metal layer is formed is ground without mirror finish.
Claim 7
Dependent Claim
15 words
The device according to claim 1, wherein said circuit board is made of polyimide resin.
Claim 8
Independent Claim
21 words
The device according to any one of claims 1, wherein the thickness of the semiconductor pellet is thinner than 0.4 mm.
Claim 9
Dependent Claim
22 words
The device according to claim 1, wherein each circuit pattern of the semiconductor pellet and circuit board is interconnected by wire boding.
Claim 10
Dependent Claim
15 words
The device according to claim 1, wherein said semiconductor pellet is sealed with epoxy resin.
Claim 11
Dependent Claim
19 words
The device according to claim 1, wherein said semiconductor pellet is sealed on the circuit board with acrylic resin.
Claim 12
Dependent Claim
93 words
A card like semiconductor device comprising a circuit board made of plastic resin and a semiconductor pellet mounted to the circuit board, wherein the improvement comprise a recess with a bottom defined in the circuit board for accommodation of the semiconductor pellet and a metal layer formed on one surface of the semiconductor pellet on which semiconductor circuit is not formed, the semiconductor pellet being secured to the circuit board by bonding the metal layer to the bottom wall of the recess and being sealed with high polymer material on the circuit board.
Claim 13
Dependent Claim
93 words
A card like semiconductor device comprising a circuit board made of plastic resin and a semiconductor pellet mounted to the circuit board, wherein the improvement comprise a recess with a bottom defined in the circuit board for accommodation of the semiconductor pellet and a metal layer formed on one surface of the semiconductor pellet on which semiconductor circuit is not formed, the semiconductor pellet being secured to the circuit board by bonding the metal layer to the bottom wall of the recess and being sealed with high polymer material on the circuit board.
Claim 14
Dependent Claim
50 words
The device according to claim 11, wherein an alloy layer is formed by at least one kind of metal element of the metal layer and at least one kind of metal element of the material constituting the semiconductor pellet in the interface of the metal layer and the semiconductor pellet.
Claim 15
Dependent Claim
32 words
The device according to claim 11, wherein said metal layer is formed by at least one kind of metal selected from a group consisting of gold, silver, nickel, aluminum, chromium and molybdenum.
Claim 16
Dependent Claim
18 words
The device according to claim 11, wherein the thickness of the metal layer is thinner than 20 µm.
Claim 17
Dependent Claim
26 words
The device according to claim 11, wherein said one face of the semiconductor pellet on which the metal layer is formed is ground without mirror finish.
Claim 18
Dependent Claim
15 words
The device according to claim 11, wherein said circuit board is made of polyimide resin.
Claim 19
Independent Claim
21 words
The device according to any one of claims 11, wherein the thickness of the semiconductor pellet is thinner than 0.4 mm.
Claim 20
Dependent Claim
22 words
The device according to claim 11, wherein each circuit pattern of the semiconductor pellet and circuit board is interconnected by wire boding.
Claim 21
Dependent Claim
15 words
The device according to claim 11, wherein said semiconductor pellet is sealed with epoxy resin.
Claim 22
Dependent Claim
19 words
The device according to claim 11, wherein said semiconductor pellet is sealed on the circuit board with acrylic resin.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.