EP0116396A2
Expired / Lapsed
EP
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Electrical assembly
Assignee: Crystalate Electronics Ltd
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Filing: 1984-01-05
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Granted: —
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Expires: 2004-01-05
Abstract
Abstract An electrical assembly incorporates a multilayer printed circuit board comprising a flexible electrically insulating circuit board laminate (1) with electrical conductors (2) for connecting to terminals (3) on rigid slab-like heat-dissipating components such as circuit or component packages or carriers (4). A separate rigid metallic heat-sinking or spreading plate (16) is applied, having protruding thermally conducting pillars (17) passing through holes (15) in the circuit board laminate (1) to contact the components (4). A further rigid plate (8, 18, 28, 38) overlies the components (4) and is clamped by clips (9,11) or bolts (31) to plate (16). Compliant means (10, 20, 30, 40) such as springs of deformable and elastic rubber or plastics material is provided intermediate the further plate (8, 18, 28, 38) and the top of the components (4) to accommodate difference in height or thickness between the components (4) while transmitting pressure from the further plate (8, 18, 28, 38) to the top of the component (4) to ensure contact between the components (4) and the pillars (17) on the heat sinking or spreading plate (16).
Inventors
- 👤 Peter Linley Kirby
- 👤 Thomas Paul Hogan
- 👤 Robert Banfield
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 18:06
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/189; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W40/641; H10W40/70; H10W40/77; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09054; H05K2201/10; H05K2201/10227; H05K2201/10393; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K3/00; H05K3/0058; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H10W40/20; H10W40/231; H10W40/233; H10W40/242
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
199 words
An electrical assembly comprising a multiplicity of rigid slab-like heat dissipating components (4) each mounted against one face of a circuit board (1) by means of interconnections between an array of electrical terminals (3) on said components (4) and electrical conductors (2) on said one face of said circuit board (1) and such that there is no insertion of said terminals (3) into said circuit board (1), said circuit board (1) being of a flexible material capable of undergoing movement in and out of and within the plane thereof, thereby minimising or avoiding strain in said interconnections and consequential risk of said components (4) becoming detached, characterised in that: regions of the circuit board underlying some or all of the components (4) incorporate holes (15); a plate (16) of thermally conductive material against the other face of the circuit board (1) has heat sink pillars (17) that project through the holes (15) into direct contact with the undersides of the components (4), flexure and planar extension or compression of the circuit board (1) permitting said direct contact to take place; and means (9, 11) are provided to maintain said heat sink pillars in thermally effective contact with said components.
Claim 2
Dependent Claim
199 words
An electrical assembly comprising a multiplicity of rigid slab-like heat dissipating components (4) each mounted against one face of a circuit board (1) by means of interconnections between an array of electrical terminals (3) on said components (4) and electrical conductors (2) on said one face of said circuit board (1) and such that there is no insertion of said terminals (3) into said circuit board (1), said circuit board (1) being of a flexible material capable of undergoing movement in and out of and within the plane thereof, thereby minimising or avoiding strain in said interconnections and consequential risk of said components (4) becoming detached, characterised in that: regions of the circuit board underlying some or all of the components (4) incorporate holes (15); a plate (16) of thermally conductive material against the other face of the circuit board (1) has heat sink pillars (17) that project through the holes (15) into direct contact with the undersides of the components (4), flexure and planar extension or compression of the circuit board (1) permitting said direct contact to take place; and means (9, 11) are provided to maintain said heat sink pillars in thermally effective contact with said components.
Claim 3
Dependent Claim
54 words
An assembly according to claim 1, in which the means to maintain the heat sink pillars in thermally effective contact with the components comprises one or more further plates (8, 8A), applied on top of the components (4) and secured by clamp means (9, 11) to the said plate (16) of thermally conductive material.
Claim 4
Dependent Claim
26 words
An assembly according to claim 1 or 2 in which the said pillars (17) are formed integrally with the said plate of thermally conductive material (16).
Claim 5
Dependent Claim
75 words
An assembly according to claims 2 or 3 in which there is provided compliant means (10) intermediate the said further plate (8) and the top of said components (4), said compliant means (10) being adapted to accommodate any difference in height or thickness between said components (4), while transmitting pressure of said clamp means (9,11) from said further plate (8) to said components (4) to ensure maintenance of contact with said heat sink pillars (17).
Claim 6
Dependent Claim
32 words
An assembly according to claim 4, in which said compliant means (10) comprises a suitably deformable and elastic rubber or plastics material in a layer or in pads overlying individual components (4).
Claim 7
Dependent Claim
85 words
An assembly according to claim 4, in which said compliant means comprises a suitably elastic membrane (20) overlying the components (4) and co-operating with said further plate, (18) the further plate (18) being provided with apertures (19) therein or therethrough in regions overlying the components (4), said apertures (19) being of larger area than the components (4), said membrane (20) serving to apply pressure to said components (4), said components (4) with said overlying membrane (20) being accommodated in part in said further plate (18).
Claim 8
Dependent Claim
39 words
An assembly according to claim 4, in which said compliant means comprise coil springs (30) between the further plate and the top of some or all of the components and provided in recesses (29) in the further plate (28).
Claim 9
Dependent Claim
15 words
An assembly according to claim 7, in which said coil springs are of conical form.
Claim 10
Dependent Claim
81 words
An assembly according to claim 4, in which said spring members comprise leaf springs (40) provided between the further plate (38) and the top of some or all of the components (4), said leaf springs (40) being formed out of a sheet of suitably resilient material which is located in contact with the further plate (38) or said leaf springs being formed integrally with the further plate (38), said further plate (38) being formed from an inherently resilient or elastic material.
Claim 11
Dependent Claim
41 words
An assembly according to any of claims 2 to 9 in which said clamp means comprises one or more clips (9, 11) adapted to be applied around said plate of thermally conductive material (16) and said further plate or plates (8,8A).
Claim 12
Dependent Claim
38 words
An assembly according to claim 10, in which said clips comprise spring clips (9, 11) or one or more threaded fasteners (31) extending between said plate of thermally conductive material (16) and said further plate or plates (28).
Claim 13
Dependent Claim
73 words
An assembly according to any preceding claim in which said components (4) comprise electric circuit or component packages or carriers of a ceramic or plastics material that accommodate chips or dies embodying semiconductor integrated circuits and said circuit board (1) is a multilayer printed circuit board comprising a planar electrically insulating flexible laminate, electrical conductor elements being arranged at one or more planes within the laminate to provide electrical connections for the components.
Claim 14
Dependent Claim
19 words
An assembly according to claim 12 in which said laminate has a thickness of not more than 0.5 millimetres.
Claim 15
Dependent Claim
19 words
An assembly according to claims 12 or 13 in which said flexible laminate comprises a polyimide or polyester material.
Claim 16
Dependent Claim
17 words
An assembly according to any preceding claim arranged in stacked relationship with one or more like assemblies.
Claim 17
Dependent Claim
43 words
An assembly according to any preceding claim in which a film or layer of additional material (50) of a resinous organic or plastics nature is provided intermediate said plate of thermally conductive material (16) and said other face of said circuit board (1).
Claim 18
Dependent Claim
18 words
An assembly according to claim 16 in which said film or layer of additional material has adhesive properties.
References Cited (Backward Citations)
No citation records indexed.
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