Patent US2764468A successfully refreshed from Google Patents.
EP0048992A2
Expired / Lapsed
EP
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Printed circuit board and method for fabricating the same
Assignee: Toshiba Corp
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Filing: 1981-09-29
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Granted: —
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Expires: 2001-09-29
Abstract
Abstract A printed circuit board has a substrate (11) having good heat dissipation and an insulating layer (12) of a ceramic material flame spray-coated thereon. This insulating layer (12) has a number of through pores (13). A resin with network structure strongly bonden to the ceramic material is formed in the through pores (13) of the insulating layer (12) and seals the through pores (13).
Inventors
- 👤 Hiroshi Oodaira
- 👤 Kenji Nagashima
- 👤 Hiroshi Matsumoto
- 👤 Masataka Tanaka
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 11:11
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/053; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0116; H05K2201/0137; H05K2201/0179; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0239; H05K2203/00; H05K2203/11; H05K2203/1147
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
82 words
A printed circuit board comprising: a substrate with good heat dissipation; an insulating layer made of a ceramic material which is formed on the surface of said substrate and which has through pores; a resin with network structure which is filled in the through pores in said insulating layer to seal the through pores, said resin with network structure being strongly bonded to said ceramic material by a silane coupling agent; and a conductive circuit pattern layer formed on said insulating layer.
Claim 2
Dependent Claim
82 words
A printed circuit board comprising: a substrate with good heat dissipation; an insulating layer made of a ceramic material which is formed on the surface of said substrate and which has through pores; a resin with network structure which is filled in the through pores in said insulating layer to seal the through pores, said resin with network structure being strongly bonded to said ceramic material by a silane coupling agent; and a conductive circuit pattern layer formed on said insulating layer.
Claim 3
Dependent Claim
17 words
A printed circuit board according to claim 1, wherein said substrate is made of a metallic material.
Claim 4
Dependent Claim
18 words
A printed circuit board according to claim 2, wherein said insulating layer comprises a frame spray-coated ceramic layer.
Claim 5
Dependent Claim
37 words
A printed circuit board according to claim 3, wherein said ceramic material is selected from the group consisting of alumina, magnesia, beryllia, spinel, aluminum nitride, boron nitride, steatide ceramic and a mixture of at least two thereof.
Claim 6
Dependent Claim
34 words
A printed circuit board according to claim 1, wherein said silane coupling agent is selected from the group consisting of vinyltrifluorosilane, vinyltriethoxysilane, vinyltris(S-methoxytoxy)silane, y-glycidoxypropyltrimethoxysilane, y-methacryloxypropyltrimethoxysilane, N-β(aminoethyl)-γ-aminopropyltrimethoxysilane, N-β(aminoethyl)-γ-aminopropylmethyldimethoxysilane, y-chloropropyltrimethoxysinane, y-mercaptopropyltrimethoxysilane, y-aminopropyltriethoxysilane, y-benzylaminopropyltrimethoxysilane, and mixtures thereof.
Claim 7
Dependent Claim
20 words
A printed circuit board according to claim 1, wherein said resin with network structure is derived from a thermosetting resin.
Claim 8
Dependent Claim
27 words
A printed circuit board according to claim 1, wherein said resin with network structure is derived from a combination of a thermoplastic resin and a multifunctional monomer.
Claim 9
Dependent Claim
31 words
A printed circuit board according to claim 1, wherein said resin with network structure is derived from a combination of a polymerizable monomer, a polymerization initiating agent and a cross-linking agent.
Claim 10
Dependent Claim
24 words
A printed circuit board according to claim 1, wherein said conductive circuit pattern layer is made of a metal layer coated by electroless plating.
Claim 11
Dependent Claim
22 words
A printed circuit board according to claim 1, wherein said conductive circuit pattern layer comprises a metal layer coated by spray coating.
Claim 12
Dependent Claim
20 words
ll. A printed circuit board according to claim 1, further comprising semiconductor elements mounted on said conductive circuit pattern layer.
Claim 13
Independent Claim
111 words
A method for fabricating a printed circuit board comprising the steps of: (a) forming an insulating layer having through pores by flame spray coating a ceramic material on the surface of a substrate having good heat dissipation; (b) introducing an organic compound composition to be converted by chemical reaction to a resin with network structure in the through pores in said insulating layer; (c) reacting said organic compound composition in the presence of a silane coupling agent in said through pores to provide a resin with network structure strongly bonded to said ceramic material for sealing said through pores; and (d) forming a conductive circuit pattern layer on said insulating layer.
Claim 14
Independent Claim
111 words
A method for fabricating a printed circuit board comprising the steps of: (a) forming an insulating layer having through pores by flame spray coating a ceramic material on the surface of a substrate having good heat dissipation; (b) introducing an organic compound composition to be converted by chemical reaction to a resin with network structure in the through pores in said insulating layer; (c) reacting said organic compound composition in the presence of a silane coupling agent in said through pores to provide a resin with network structure strongly bonded to said ceramic material for sealing said through pores; and (d) forming a conductive circuit pattern layer on said insulating layer.
Claim 15
Dependent Claim
15 words
A method according to claim 12, wherein said substrate is made of a metal material.
Claim 16
Dependent Claim
42 words
A method according to claim 13, wherein said resin with network structure is formed by treating the through pores of said insulating layer with the silane coupling agent, impregnating the organic compound composition into said through pores and reacting said organic compound.
Claim 17
Dependent Claim
40 words
A method according to claim 13, wherein said resin with network structure is formed by filling a mixture of the organic compound composition and the silane coupling agent in the through pores of said insulating layer, and reacting said mixture.
Claim 18
Dependent Claim
28 words
A method according to claim 14 or 15, wherein the organic compound composition comprises a thermosetting resin or a combination of a curing agent and a thermosetting resin.
Claim 19
Dependent Claim
28 words
A method according to claim 14 or 15, wherein the organic compound composition comprises a combination of a thermoplastic resin and a multifunctional monomer as a cross-linking agent.
Claim 20
Dependent Claim
28 words
A method according to claim 14 or 15, wherein the organic compound composition comprises a combination of a polymerizable monomer, a polymerization initiating agent and a cross-linking agent.
Claim 21
Dependent Claim
17 words
A method according to claim 1, wherein said conductive circuit pattern layer is formed by electroless plating.
Claim 22
Dependent Claim
23 words
A method according to claim 1, wherein said conductive circuit pattern layer is formed by flame spray coating a metal on said substrate.
Claim 23
Dependent Claim
20 words
A method according to claim 1, further comprising the step of mounting semiconductor elements on said conductive circuit pattern layer.
References Cited (Backward Citations)
No citation records indexed.
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